Our linear guide assemblies are available in UP ultra precision accuracy grade, adopting a half pitch hole layout to deliver superior mounting accuracy for easier high precision assembly. Our product lineup serves core semiconductor workflows, including wafer fabrication, photolithography, ion implantation, wafer dicing, die bonding, wire bonding and chip packaging. Delivering micron level running stability, our portfolio covers ball type linear guides, roller type linear guides, curved guide assemblies and special rolling spline assemblies. These solutions address diverse process specific requirements: dust free operation, vacuum service, high temperature endurance, high rigidity, heavy load capacity and non magnetic performance.
