Semiconductor Dicing Equipment Linear Guide

GGB BA/BAL Precision Ball Linear Guide for Wafer Dicing Machines

Nanjing Yigong GGB BA/BAL precision ball linear guides are engineered as linear guides for wafer dicing machines and other high-precision semiconductor dicing equipment. With a 45° equal-division contact-angle design, each guide delivers equal rated load capacity in all four directions, high rigidity, and strong anti-overturning moment — exactly what the motion axis of a 12-inch dicing saw demands.

Key specifications: maximum speed up to 180 m/min, top accuracy grade 1, motion accuracy 0.004 mm/1000 mm, single rail length up to 6000 mm, and low-noise operation. These characteristics make GGB guides ideally suited to semiconductor dicing platforms such as (JCA) AR9000W and AR-series 6"–20" dicing machines, where precision imported linear guides and Y-axis scale closed-loop control maintain long-term machine accuracy.

Backed by 70+ years of rolling functional parts expertise and National Manufacturing Single Champion status, Nanjing Yigong provides an import-substitution option for THK/HIWIN-class semiconductor dicing guides — with C-level precision, cleanroom-compatible lubrication, and short lead times.

Contact our engineering team for guide sizing tailored to your dicing equipment.