This non‑magnetic high‑precision ball linear guide pair is specially developed for semiconductor equipment. Serving as a direct equivalent to THK and IKO counterparts, it features outstanding positioning accuracy and smooth motion performance.
Built to adapt to harsh semiconductor working scenarios, the guide unit performs reliably in dust‑free, vacuum, high‑temperature and high‑rigidity environments. It ensures stable micron‑level movement for wafer processing, dicing, die bonding and chip packaging processes, offering a high‑performance domestic alternative for precision semiconductor automation.
