Moving forward with GONGYI

In semiconductor backend processing, the margin for error during wafer singulation is virtually zero. With kerf widths shrinking to 50–100 μm and chipping tolerances strictly capped below 10 μm, mechanical vibration remains the primary enemy of yield. High-speed dicing generates significant thermal Read More

The financial stakes of semiconductor dicing equipment are immense, as sub-micron deviations in kerf width directly correlate to die chipping, yield loss, and scrapped wafers. High-speed diamond wheel dicing presents severe physical challenges for manufacturers. Engineers must manage intense vibrati Read More

In semiconductor manufacturing, wafer yield margins are unforgiving. Even microscopic deviations during the dicing process result in unacceptable kerf loss, micro-chipping, and scrapped silicon. High-speed spindle vibration and mechanical thermal drift directly compromise cutting precision. Standard Read More