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Semiconductor Dicing Equipment ball screws

Nanjing Yigong precision ball screws deliver micron-level feed accuracy for wafer dicing machines​ and semiconductor dicing equipment. Key specs: up to 60 m/min speed, C0/P0 accuracy grade, Φ32–Φ80 mm diameter, 10–40 mm lead, μm-level stability under high-speed operation. Ideal for 12-inch dicing platforms such as JCA's AR9000W. A proven import-substitution alternative to THK/HIWIN, backed by 70+ years of rolling functional parts expertise.
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