Moving forward with GONGYI

The financial stakes of semiconductor dicing equipment are immense, as sub-micron deviations in kerf width directly correlate to die chipping, yield loss, and scrapped wafers. High-speed diamond wheel dicing presents severe physical challenges for manufacturers. Engineers must manage intense vibrati Read More

In semiconductor manufacturing, wafer yield margins are unforgiving. Even microscopic deviations during the dicing process result in unacceptable kerf loss, micro-chipping, and scrapped silicon. High-speed spindle vibration and mechanical thermal drift directly compromise cutting precision. Standard Read More

As semiconductor dicing streets shrink to the 36.0–80 µm range, the mechanical tolerance for error during the dicing process approaches absolute zero. Micro-vibrations, pitch and yaw deviations, and inconsistent feed rates directly cause edge chipping and kerf deviation during wafer separation. In h Read More