Our ultra‑precision curved guide pair is specially engineered for 12‑inch (300 mm) wafer thinning equipment. Adopting optimized rolling contact structure, it realizes steady low‑vibration circular movement and high‑repeatability positioning performance.
Designed for clean‑room semiconductor production, it maintains consistent motion accuracy during wafer grinding and thinning procedures. It effectively satisfies the demanding precision and stability requirements of wafer back‑side thinning process, acting as a high‑performance domestic replacement for imported curved guide assemblies.
